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STGB14NC60KDT4 Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Category:

IGBTs

Case Package:

TO-263-3

Description:

Trans IGBT Chip N-CH 600V 25A 80000mW 3Pin(2+Tab) D2PAK T/R

Pictures:

3D Model

Symbol

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Pinout

Product Pictures

Documentation:

STGB14NC60KDT4 Datasheet (16 Pages)

Package Outline Dimension on10 Page 11 Page 12 Page 13 Page

STGB14NC60KDT4 Datasheet PDF (16 Pages)

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STGB14NC60KDT4 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Voltage Rating (DC)

600 V

Current Rating

25.0 A

Case/Package

TO-263-3

Polarity

N-Channel

Power Dissipation

80000 mW

Input Capacitance

760 pF

Rise Time

8.50 ns

Breakdown Voltage (Collector to Emitter)

600 V

Thermal Resistance

62.5 ℃/W

Reverse recovery time

37 ns

Input Power (Max)

80 W

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

80000 mW

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STGB14NC60KDT4 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Size-Width

9.35 mm

Operating Temperature

-55℃ ~ 150℃ (TJ)

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STGB14NC60KDT4 Environmental

STGB14NC60KDT4 Export Classifications

STGB14NC60KDT4 Function Overview

STGB14NC60KDT4 Documents

STGB14NC60KDT4 Datasheet

ST Microelectronics

16 Pages / 0.52 MByte

STGB14NC60KDT4 Other References

ST Microelectronics

1 Pages / 0.13 MByte

STGB14NC60 Documents

STGB14NC60KDT4 Datasheet PDF

ST Microelectronics

Trans IGBT Chip N-CH 600V 25A 80000mW 3Pin(2+Tab) D2PAK T/R

STGB14NC60KT4 Datasheet PDF

ST Microelectronics

Trans IGBT Chip N-CH 600V 25A 80000mW 3Pin(2+Tab) D2PAK T/R

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