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STGB19NC60KDT4 Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Category:

IGBTs

Case Package:

TO-263-3

Description:

Trans IGBT Chip N-CH 600V 35A 125000mW 3Pin(2+Tab) D2PAK T/R

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Documentation:

STGB19NC60KDT4 Datasheet (19 Pages)

Package Outline Dimension on10 Page 11 Page 12 Page 13 Page 14 Page

STGB19NC60KDT4 Datasheet PDF (19 Pages)

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STGB19NC60KDT4 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Case/Package

TO-263-3

Power Dissipation

125000 mW

Breakdown Voltage (Collector to Emitter)

600 V

Reverse recovery time

31 ns

Input Power (Max)

125 W

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

125000 mW

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STGB19NC60KDT4 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Operating Temperature

-55℃ ~ 150℃ (TJ)

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STGB19NC60KDT4 Environmental

STGB19NC60KDT4 Export Classifications

STGB19NC60KDT4 Function Overview

STGB19NC60KDT4 Documents

STGB19NC60KDT4 Datasheet

ST Microelectronics

19 Pages / 1 MByte

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