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STGB20NC60V Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Category:

IGBTs

Case Package:

TO-263-3

Description:

Trans IGBT Chip N-CH 600V 60A 200000mW 3Pin(2+Tab) D2PAK T/R

Pictures:

3D Model

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Pinout

Product Pictures

Documentation:

STGB20NC60V Datasheet (20 Pages)

Package Outline Dimension on10 Page 11 Page 12 Page 13 Page 14 Page

STGB20NC60V User Reference Manual Guide (51 Pages)STGB20NC60V Application Note (35 Pages)

STGB20NC60V Datasheet PDF (20 Pages)

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STGB20NC60V Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Case/Package

TO-263-3

Number of Positions

3 Position

Power Dissipation

200 W

Breakdown Voltage (Collector to Emitter)

600 V

Input Power (Max)

200 W

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

200000 mW

View Datasheet >

STGB20NC60V Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Operating Temperature

-55℃ ~ 150℃ (TJ)

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STGB20NC60V Environmental

STGB20NC60V Export Classifications

STGB20NC60V Function Overview

STGB20NC60V Documents

STGB20NC60V Datasheet

ST Microelectronics

20 Pages / 0.45 MByte

STGB20NC60V User Reference Manual Guide

ST Microelectronics

51 Pages / 2.12 MByte

STGB20NC60V Application Note

ST Microelectronics

35 Pages / 2.4 MByte

STGB20NC60 Documents

STGB20NC60V Datasheet PDF

ST Microelectronics

Trans IGBT Chip N-CH 600V 60A 200000mW 3Pin(2+Tab) D2PAK T/R

STGB20NC60VT4 Datasheet PDF

ST Microelectronics

Trans IGBT Chip N-CH 600V 60A 200000mW 3Pin(2+Tab) D2PAK T/R

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