Part 3D Model

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TC58NVG0S3EBAI4 Datasheet PDF - Toshiba

Manufacturer:

Toshiba

Category:

Flash Memory

Case Package:

BGA

Description:

SLC NAND Flash 3.3V 1Gbit 63Pin TFBGA

Pictures:

3D Model

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Product Pictures

TC58NVG0S3EBAI4 Datasheet PDF (45 Pages)

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TC58NVG0S3EBAI4 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

63 Pin

Case/Package

BGA

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

3.3 V

TC58NVG0S3EBAI4 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Size-Length

11 mm

Size-Width

9 mm

Size-Height

0.74 mm

Operating Temperature

-40℃ ~ 85℃

TC58NVG0S3EBAI4 Environmental

TC58NVG0S3EBAI4 Export Classifications

TC58NVG0S3EBAI4 Documents

TC58NVG0S3EBAI4 Other Datasheet PDF

Toshiba

45 Pages / 0.29 MByte

TC58NVG0S3EBAI4 Product Catalog

Toshiba

4 Pages / 0.15 MByte

TC58NVG0S3 Documents

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NAND Flash Serial 3.3V 1G-bit 128M x 8 48Pin TSOP-I

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SLC NAND Flash 3.3V 1Gbit 63Pin TFBGA

TC58NVG0S3ETA00 Datasheet PDF

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IC 128M X 8 EEPROM 3V, PDSO48, 12 X 20MM, 0.5MM PITCH, PLASTIC, TSOP1-48, Programmable ROM

TC58NVG0S3ETAI0 Datasheet PDF

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SLC NAND Flash Parallel 3.3V 1Gbit 128M x 8Bit 48Pin TSOP-I

TC58NVG0S3HBAI6 Datasheet PDF

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1GB SLC NAND 24NM BGA 6.5X8 (EEPROM)

TC58NVG0S3HTAI0 Datasheet PDF

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EEPROM SLC 1GB NAND 24NM 48TSOP

TC58NVG0S3HBAI4 Datasheet PDF

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1GB SLC NAND 24NM BGA 9X11 (EEPROM)

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IC 128M X 8 EEPROM 3V, PDSO48, 12 X 20MM, 0.5MM PITCH, PLASTIC, TSOP1-48, Programmable ROM

TC58NVG0S3EBAI4LR0 Datasheet PDF

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SLC NAND Flash 3.3V 1G-bit 63Pin FBGA T/R

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