UGF10BCT-E3/45 Datasheet PDF - Vishay Semiconductor

●FEATURES

●• Glass passivated chip junction

●• Ultrafast recovery times

●• Soft recovery characteristics

●• Low switching losses, high efficiency

●• High forward surge capability

●• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)

●• Solder dip 260 °C, 40 s (for TO-220AB and ITO-220AB package)

●• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC