Part 3D Model

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XC7Z035-2FFG900I Datasheet PDF - Xilinx

Manufacturer:

Xilinx

Category:

Microprocessors

Case Package:

BBGA-900

Description:

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900Pin FC-BGA

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

XC7Z035-2FFG900I User Reference Manual Guide (80 Pages)XC7Z035-2FFG900I Programming Manual (85 Pages)

XC7Z035-2FFG900I Datasheet PDF (80 Pages)

View Datasheet

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XC7Z035-2FFG900I Specifications

TYPE

DESCRIPTION

Number of Pins

900 Pin

Case/Package

BBGA-900

Number of Positions

900 Position

RAM Memory Size

256 KB

XC7Z035-2FFG900I Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tray

Operating Temperature

-40℃ ~ 100℃ (TJ)

XC7Z035-2FFG900I Environmental

XC7Z035-2FFG900I Function Overview

XC7Z035-2FFG900I Documents

XC7Z035-2FFG900I User Reference Manual Guide

Xilinx

80 Pages / 2.65 MByte

XC7Z035-2FFG900I Programming Manual

Xilinx

85 Pages / 2.68 MByte

XC7Z035-2FFG900I Notice File

Xilinx

5 Pages / 0.06 MByte

XC7Z0352FFG900 Documents

XC7Z035-2FFG900I Datasheet PDF

Xilinx

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900Pin FC-BGA

XC7Z035-2FFG900E Datasheet PDF

Xilinx

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900Pin FC-BGA

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