Part 3D Model

$ 1.431

W25Q256FVFIQ Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

SOIC-16

Description:

NOR Flash Serial-SPI 3.3V 256M-bit 32M x 8 8.5ns 16Pin SOIC

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

W25Q256FVFIQ Datasheet (92 Pages)

Pinout Diagram on7 Page 8 Page 10 PageHot

Part Numbering System on90 Page

W25Q256FVFIQ Datasheet PDF (92 Pages)

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W25Q256FVFIQ Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

16 Pin

Case/Package

SOIC-16

Clock Speed

104 MHz

Number of Bits

8 Bit

Access Time(Max)

7 ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.7V ~ 3.6V

View Datasheet >

W25Q256FVFIQ Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Discontinued at Digi-Key

Packaging

Tube

Operating Temperature

-40℃ ~ 85℃ (TA)

View Datasheet >

W25Q256FVFIQ Environmental

W25Q256FVFIQ Function Overview

W25Q256FVFIQ Documents

W25Q256FVFIQ Datasheet

Winbond Electronics

92 Pages / 2.44 MByte

W25Q256FVFIQ Other Datasheet PDF

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108 Pages / 1.49 MByte

W25Q256FVFIQ Features Description Parametrics

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109 Pages / 2.73 MByte

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W25Q256FVFIQ Datasheet PDF

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