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Part Datasheet Search > Memory Chip > Winbond Electronics > W25Q256JVBIQ Datasheet PDF
W25Q256JVBIQ
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W25Q256JVBIQ Datasheet PDF - Winbond Electronics

Manufacturer:
Winbond Electronics
Category:
Memory Chip
Case Package:
TBGA-24
Description:
Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 32M x 8 6ns 24Pin TFBGA Tray
Pictures:
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Product Pictures
Documentation:
W25Q256JVBIQ Datasheet (92 Pages)
Pinout Diagram on7 Page8 Page10 PageHot
Part Numbering System on90 Page
W25Q256JVBIQ Datasheet PDF (92 Pages)
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W25Q256JVBIQ Specifications

TYPE
DESCRIPTION
Number of Pins
24 Pin
Case/Package
TBGA-24
Number of Bits
8 Bit
Access Time(Max)
6 ns
Operating Temperature (Max)
85 ℃
Operating Temperature (Min)
-40 ℃
Supply Voltage
2.7V ~ 3.6V
View Datasheet >

W25Q256JVBIQ Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tray
Operating Temperature
-40℃ ~ 85℃ (TA)
View Datasheet >

W25Q256JVBIQ Documents

W25Q256JVBIQ Datasheet
Winbond Electronics
92 Pages / 2.44 MByte
W25Q256JVBIQ Other Datasheet PDF
Winbond Electronics
92 Pages / 0.85 MByte

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