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W25Q256JVCIQ Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

TBGA-24

Description:

IC FLASH 256Mbit 4KB 24TFBGA

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

W25Q256JVCIQ Datasheet (92 Pages)

Pinout Diagram on7 Page 8 Page 10 PageHot

Part Numbering System on90 Page

W25Q256JVCIQ Datasheet PDF (92 Pages)

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W25Q256JVCIQ Specifications

TYPE

DESCRIPTION

Case/Package

TBGA-24

Number of Bits

8 Bit

Access Time(Max)

6 ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.7V ~ 3.6V

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W25Q256JVCIQ Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tray

Operating Temperature

-40℃ ~ 85℃ (TA)

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W25Q256JVCIQ Environmental

W25Q256JVCIQ Function Overview

W25Q256JVCIQ Documents

W25Q256JVCIQ Datasheet

Winbond Electronics

92 Pages / 2.44 MByte

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